IC chip (Integrated Circuit Chip) is a large number of microelectronic components (transistors, resistors, capacitors, etc.) formed by integrated circuits on a plastic base, made into a chip. IC chip contains wafer chips and packaging chips, the corresponding IC chip production line by the wafer production line and packaging production line consists of two parts.Procurement personnel must see the IC chip identification knowledge is summarized as five points: A look, B break, C analysis, D measurements, E photos.
A. Look
1, look at the surface of the silkscreen (branding) model is consistent with the device model.
Mainly including the brand logo, prefix, device function serial number, suffix, special labeling
Brand logo: most of the device brand logo, a small number of no. (Examples omitted)
Prefix: represents the semiconductor manufacturer. (example omitted)
Device function serial number: describe the functional characteristics of the same series of devices. Many manufacturers of general-purpose devices, the device function serial number is quite partly the same, but there are also different.
Example: 8870 LM317 IMP813 MAX813 MAX232 SPX232
Suffix: description of the device’s operating voltage, temperature range, package type, speed, etc.
Operating voltage (output voltage): The range of normal operating voltage. DS1230AB-100, DS1230Y-100
AM29F040 AM29DL040 LT1117-5. /3.3 LM1117-5/3.
Temperature range: Grade for: Commercial grade: 0℃-70℃
Industrial grade: -40℃-85℃
Automotive grade: -40℃-125℃
Military grade: -55℃-125℃/150℃
Package type: DIP (PDIP, CDIP), PLCC, QFP, TQFP, SOP, SSOP, TSSOP
TO-92, TO-220, TO-263, TO-223, TO-23, CLCC
Speed: Describes how fast or slow data access is
IS62C256-50/70/90 XC95144 AT89C51-12/16/20/24
Special labeling: such as table threshold voltage IMP706
Production lot number: “0451”, factory number, batch, etc.
Above, accurate information needs to refer to its PDF material to be more accurate.
2, look at the device screen printing (branding) neat degree, the surface of the glossy situation, the degree of oxidation of the tube pin.
Screen printing (branding), the quality of good or bad and screen printing materials, screen printing machine precision. The screen printing quality of the original device is very good, but there are some poor. Such as the national half 01 + part of the device.
Surface gloss: from different angles (vertical front view, oblique view, flat view) to see whether the device surface is uniform and smooth, there is no scratch marks. Also can be seen with the help of high magnification.
Most of the device pins are coated with a layer of oxide film, but there are devices without obvious oxide film, such as TI’s 74 series DIP package logic devices.
3, look at the mark on the back of the device, these marks are generally raised lettering.
Some devices are marked on the back “C”, “D”, etc., representing the production batch.
Some devices marked on the back, “Malaysia”, “Taiwan”, “Thailand”, ” Mexico”, “Korea”, “China”, representing the location of the package, to clarify the location of the package factory.
B. Judge
1, the categories of device performance to determine the possibility of device quality.
(1) Logic circuit: 74 series, 54 series characteristics, classification, basic principles and applications.
(2), microprocessors: 8/16/32-bit microcontroller (MCU) and digital signal processor (DSP)
51 series, AVR high-speed series, INTEL196 series, PIC series, MSP430 ultra-low-power and many other microcontrollers; TMS320 full series, ADSP series, MC series and other DSPs.
Basic construction and function, classification and differences, basic design of hardware, software (assembly language and C51 language) preliminary design ideas and practice, the use of development tools and debugging process of the program.
(3) Extension of microprocessor and application of peripheral circuits.
(1) The difference between memory (FLASH, EEPROM, SRAM, NVRAM) and basic applications.
(2) Interface circuits (RS-232, RS-485/422, USB, CAN, MODEM, 1394 port
ISDN) functions and basic design.
(3) Difference, principle and basic design of display (LCD, LED, LCM, VFD, EL) and driver.
(4) PSD and programmable logic circuits.
The construction, basic principles and applications of PSD, the construction, basic principles and preliminary design of FPGA and CPLD (hardware
design, basic design of VHDL language).
(5), Digital Converters
ADC, DAC characteristics, application areas, preliminary design; multimedia products – audio, video part of the application circuit introduction.
(6), power supply and related products
(1) The characteristics and application design of voltage regulator and voltage reference.
(2) Power monitoring circuits for microprocessors: reset circuit, Watchdog, Watchdog +SRAM.
3）Design of battery capacity management and charging circuit.
4）Characteristics and applications of DC-DC and AC-DC.
(5) Characteristics and applications of PWM controller, MOSFET and Darlington tube.
(7), op-amp and signal conditioner
Amplifiers, comparators, signal conditioners characteristics and applications.
(8), sensors
The characteristics and applications of pressure sensors, temperature sensors, acceleration sensors, current sensors, magnetic field sensors, humidity sensors, smoke sensors, Hall effect sensors, etc.
2, from the characteristics of the manufacturer of the semiconductor to determine the merits of the device.
See the company’s English CATALOG
C. Decap
Through chemical treatment, dissect the core of the components, electronically photograph and analyze them, and draw valid conclusions.
Thick film circuit: DS1230AB, DS1249, DS1245
D. Test
By test methods.
Online test: test dynamic parameters
Off-line test: test static parameters, test dormant parameters
Parameter test: test typical values, DC (DC) parameter test, AC (AC) parameter test
By test tools.
According to the functional characteristics of the device.
Memory, Flash FPGA: LAB-48, Rivero, Super Read-Write-Read-Erase
Analog devices: op-amps, comparators, etc.
Digital circuits.
By test tool manufacturers: Tektronix, Teradyne, Ando Electron, Aduantest, Megatest, IST, ABI
Polar, Agilent
Others: do special test stands
- Light (X-Ray)
Use special laser equipment to see through the chip internal distance array structure.
The function of ic chip
1. ic chip use-reduce the use of components
The birth of integrated circuits, small-scale integrated circuits to reduce the number of content components, there has been a great technical improvement in the fragmented components.
2, ic chip use – product performance has been effectively improved
The components are all gathered together, not only to reduce the interference of external electrical signals, but also in the circuit design has been greatly improved, to improve the operating speed.
3, ic chip use – more convenient application
conclusion
If the CPU is compared to the heart of the entire computer system, then the chip set on the motherboard is the torso of the entire body. For the motherboard, the chipset almost determines the function of this motherboard, which in turn affects the performance of the entire computer system, the chipset is the soul of the motherboard.
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